Vacuum Wands for Die Handling

Die handling wands are ideal for die and small semiconductor wafer handling. They handle a delicate and fragile wafer, part-wafer or die gently and precisely. The wands are available in ESD safe plastic or Teflon. A wide variety of nozzles in sizes down to just 80 microns in diameter are available in various sizes and materials to suit the application. Suction cups from 2.5 mm in diameter are also available for use where the application permits. Furthermore, our flat wafer handling tips can be used for large dies where contact on the back is possible. Our unique control valve ensures reliable suction and instantaneous release

Features
  • Unique valve ensures reliable suction and release of a semiconductor wafer.
  • The well polished inner wall of the valve part minimizes particle generation.
  • The optically polished wafer tip provides excellent adhesion to a wafer.
  • The vacuum wand body can be easily detached from the tubing.
Applications

Jewlery Making

Die Handling

Wands

C001/2/3 Wand

Made with Conductive Nylon
ESD Protection

F001/2/3 Wand

Made with Teflon
ESD Protection

Attachments

Nozzles, cups and tips
Click to view products

Ordering Guide

Material

C Series

Made with Conductive Nylon

F Series

Made with Teflon

Valve

001

Normally Closed (NC) Valve
Push button to pick up

002

Normally Open (NO) Valve
Push button to release

003

Normally Open w/ On/Off Switch (NO+SW) Valve
Push button to release

Attachments

NN-X

Wand tips and cups for every application

Interactive Catalog

Use Fluoro Mechanic's interactive catalog to find the right part for your application.

2646 Lehigh Street
Whitehall, PA 18052, USA
(610) 443-2015
sales@sunboundtechnology.com